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  asmt-mx22 / asmt-mxe2 moonstone 3 w high brightness power led light source data sheet description the moonstone 3w high brightness power led light source is a high performance energy effi cient device which can handle high thermal and high driving current. the exposed pad design has excellent heat transfer from the package to the motherboard. the cool white power led is available in various color temperature ranging from 4000 k to 10000 k and warm white power led ranging from 2600 k to 4000 k. the low profi le package design is suitable for a wide variety of applications especially where height is a con- straint. the package is compatible with refl ow soldering. this will give more freedom and fl exibility to the light source designer. applications ? sign backlight ? safety, exit and emergency sign lightings ? specialty lighting such as task lighting and reading lights ? retail display ? commercial lighting ? accent or marker lightings, strip or step lightings ? portable lightings, bicycle head lamp, torch lights. ? decorative lighting ? architectural lighting ? pathway lighting ? street lighting ? pedestrian street lighting ? tunnel lighting features ? available in cool white & warm white color ? energy effi cient ? exposed pad for excellent heat transfer ? suitable for refl ow soldering process ? high current operation ? long operation life ? wide viewing angle ? silicone encapsulation ? non-esd sensitive (threshold > 16 kv) ? msl 4 products specifi cations ? ingan technology ? 3.5 v (max) at 350 ma ? 110 viewing angle
2 package dimensions notes: 1. all dimensions are in millimeters. 2. unless otherwise stated, the tolerance for dimension is 0.1 mm. 3. metal slug is connected to anode for electrically non-isolated option. figure 1. asmt-mx22 / asmt-mxe2 package outline drawing. metal slug cathode anode 1 2 3 10.00 8.50 3 1 2 8.50 ? 5.26 ? 8.00 5.08 0.81 2.00 5.25 1.30 10.60 1.27 3.30 heat sink led zener + ?
3 part numbering system note: 1. please refer to page 8 for selection details. device selection guide (t j = 25 c) part number color luminous flux, ? v [1,2] (lm) test current (ma) die technology electrically isolated metal slug min. typ. max. asmt-mw22-nnp00 cool white 110 120 140 350 ingan yes ASMT-MY22-NMP00 warm white 95 100 140 350 ingan yes asmt-mwe2-nnp00 cool white diff used 110 115 140 350 ingan yes asmt-mye2-nmp00 warm white diff used 95 98 140 350 ingan yes notes: 1. ? v is the total luminous fl ux output as measured with an integrating sphere at 25 ms mono pulse condition. 2. flux tolerance is 10%. asmt C m x 1 x 2 x 3 C n x 4 x 5 x 6 x 7 packaging option color bin selection max flux bin selection min flux bin selection heat sink 2 C electrically isolated silicone type 2 C non-diffused e C diffused color w C cool white y C warm white
4 absolute maximum ratings parameter asmt- mx22 / asmt-mxe2 units dc forward current [1] 700 ma peak pulsing current 2400 ma power dissipation 2730 mw led junction temperature 125 c operating metal slug temperature range at 350 ma -40 to +110 c operating metal slug temperature range at 700 ma -40 to +95 c storage temperature range -40 to +120 c soldering temperature refer to figure 11 reverse voltage [2] not recommended note: 1. derate linearly based on figure 9. 2. not designed for reverse bias operation. optical characteristics at 350 ma (t j = 25 c) part number color correlated color temperature, cct (kelvin) viewing angle 2 ? ? [1] () luminous effi ciency (lm/w) min. max. typ. typ. asmt-mw22-nnp00 cool white 4000 10000 110 107 ASMT-MY22-NMP00 warm white 2600 4000 110 89 asmt-mwe2-nnp00 cool white diff used 4000 10000 110 103 asmt-mye2-nmp00 warm white diff used 2600 4000 110 88 notes: 1. ? ? is the off -axis angle where the luminous intensity is ? the peak intensity.
5 electrical characteristic at 350 ma (t j = 25 c) dice type forward voltage, v f (volts) thermal resistance, r ? j-ms (c/w) [1] temperature coeffi cient of forward voltage (mv/c), ? v f / ? t j min. typ. max. typ. typ. ingan 2.8 3.2 3.5 10 -1.5 to -3.5 note: 1. r ? j-ms is the thermal resistance from led junction to metal slug. typical characteristic at 700 ma (t j = 25 c) part number color luminous flux, ? v (lm) forward voltage, v f (volts) typ. typ. asmt-mw22-nnp00 cool white 205 3.6 ASMT-MY22-NMP00 warm white 170 3.6 asmt-mwe2-nnp00 cool white diff used 196 3.6 asmt-mye2-nmp00 warm white diff used 167 3.6
6 figure 2. relative intensity vs. wavelength. figure 3. relative luminous flux vs. forward current. figure 4. forward current vs. forward voltage. figure 5. radiation pattern. figure 6. maximum pulse current vs. pulse duration. derated based on t a = 25 c, r ? j-a = 30c/w. figure 7. maximum pulse current vs. pulse duration. derated based on t a = 85 c, r ? j-a = 30c/w. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity warm white cool white 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensity 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 0 100 200 300 400 500 600 700 mono pulse current - ma relative luminous flux (normalized at 350 ma) 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 0 0.5 1 1.5 2 2.5 3 3.5 4 forward voltage - v forward current - ma d= t p t t p i f t 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 0.00001 0.001 0.1 10 pulse current, i p - a pulse duration, t p - sec d= t p t t p i f t 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 0.00001 0.001 0.1 10 pulse current, i p - a pulse duration, t p - sec d = 0.05 0.10 0.25 0.50 1.00 d = 0.05 0.10 0.25 0.50 1.00
7 figure 9. maximum forward current vs. ambient temperature. derated based on t jmax = 125 c, r ? j-a = 20c/w, 25c/w and 30c/w. figure 10. maximum forward current vs. metal slug temperature. derated based on t jmax = 125 c, r ? j-ms = 10c/w. figure 11. recommended refl ow soldering. figure 12. recommended soldering land pattern. (acc. to j-std-020c) 217c 200c 60 - 120 sec. 6c/sec. max. 3c/sec. max. 3c/sec. max. 150c 255 - 260c 100 sec. max. 10 - 30 sec. time temperature 10.700.10 8.400.10 3.10.10 5.080.10 1.000.10 17.000.20 figure 8. relative light output vs. junction temperature. 0 100 200 300 400 500 600 700 800 0 20 40 60 80 100 120 140 t a - ambient temperature - c max allowable dc current - ma 0 100 200 300 400 500 600 700 800 0 20 40 60 80 100 120 140 t ms - metal slug temperature - c max allowable dc current - ma r t j-ms = 10c/w r t j-a = 30c/w r t j-a = 20c/w r t j-a = 25c/w 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 100.0 110.0 120.0 -50 -25 0 25 50 75 100 125 150 relative light output (%) (normalized at 25 c) junction temperature, t j - c warm white cool white note: for detail information on refl ow soldering of avago surface mount leds, do refer to avago application note an1060 surface mounting smt led indicator components.
8 color bin selections [x 3 ] individual reel will contain parts from one color bin selection only. cool white selection bin id 0 full distribution a a only b b only c c only d d only e e only f f only g g only h h only l a and g only m b and h only n a and c only p b and d only q e and c only r f and d only s g and h only u e and f only w c and d only z a and b only 1 a, b, c and d only 2 g, h, a and b only 4 c, d, e and f only warm white selection bin id 0 full distribution a a only b b only c c only d d only e e only f f only n a and c only p b and d only q e and c only r f and d only u e and f only w c and d only z a and b only 1 a, b, c and d only 4 c, d, e and f only flux bin limit [x 4, x 5 ] bin luminous flux (lm) at i f = 350ma min. max. k 56.0 73.0 l 73.0 95.0 m 95.0 110.0 n 110.0 125.0 p 125.0 140.0 tolerance for each bin limits is 10%. option selection details asmt C m x 1 x 2 x 3 C n x 4 x 5 x 6 x 7 x 4 C minimum flux bin x 5 C maximum flux bin x 6 C color bin selection x 7 C packaging option
9 color bin limit cool color limits white (chromaticity coordinates) bin a x 0.367 0.362 0.329 0.329 y 0.400 0.372 0.345 0.369 bin b x 0.362 0.356 0.329 0.329 y 0.372 0.330 0.302 0.345 bin c x 0.329 0.329 0.305 0.301 y 0.369 0.345 0.322 0.342 bin d x 0.329 0.329 0.311 0.305 y 0.345 0.302 0.285 0.322 bin e x 0.303 0.307 0.283 0.274 y 0.333 0.311 0.284 0.301 bin f x 0.307 0.311 0.290 0.283 y 0.311 0.285 0.265 0.284 bin g x 0.388 0.379 0.362 0.367 y 0.417 0.383 0.372 0.400 bin h x 0.379 0.369 0.356 0.362 y 0.383 0.343 0.330 0.372 tolerance: 0.01 warm color limits white (chromaticity coordinates) bin a x 0.452 0.488 0.470 0.438 y 0.434 0.447 0.414 0.403 bin b x 0.438 0.470 0.452 0.424 y 0.403 0.414 0.384 0.376 bin c x 0.407 0.418 0.452 0.438 y 0.393 0.422 0.434 0.403 bin d x 0.395 0.407 0.438 0.424 y 0.362 0.393 0.403 0.376 bin e x 0.381 0.387 0.418 0.407 y 0.377 0.404 0.422 0.393 bin f x 0.373 0.381 0.407 0.395 y 0.349 0.377 0.393 0.362 tolerance: 0.01 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 x - coordinate y - coordinate y - coordinate b c e d a f 7k 10k 4.0k g h 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 x - coordinate b c e d a f 3.0k 3.5k 4.0k 2.6k 5.6k 4.5k black body curve black body curve packaging option [x 7 ] selection option 0 tube 1 tape and reel example asmt-mw20-nlnz0 asmt-mw20-nxxxx C c ool white, electrically non-isolated heat sink, non-diff used x 4 = l C minimum flux bin l x 5 = n C maximum flux bin n x 6 = z C color bin a and b only x 7 = 0 C tube option figure 14. color bins (warm white). figure 13. color bins (cool white).
10 dim value a o 8.800.10 b o 16.450.10 k o 3.600.1 e 1.750.10 f 11.500.10 w 24.00.10 p 16.00.10 q'ty/reel 250 units all dimensions in millimeters. tape & reel C option 1 packing tube C option 0 figure 15. tube dimensions figure 16. carrier tape dimensions 535.00 1.00 5.45 5.80 4.65 5.50 10.10 37.00 8.30 top view side view a a b ao b p section b section a ko w f e bo 2.5
11 reel dimension r10.00 60.0o ? 268.00 ? 330.00 1.00 ? 99.50 1.00 2.30 2.30 24.0 +1.00 ?0.00 ? 13.50 0.50 2.50 0.50 r10.50 0.50 120.0o end minimum of 160 mm of empty component pockets sealed with cover tape. mounted with components minimum of 390 mm of empty component pockets sealed with cover tape. start figure 17. carrier tape leader and trailer dimensions. figure 18. reel dimensions.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2011 avago technologies. all rights reserved. av02-3158en - september 29, 2011 handling precaution the encapsulation material of the product is made of silicone for better reliability of the product. as silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. these might damage the product and cause premature failure. during assembly or handling, the unit should be held on the body only. please refer to avago application note an 5288 for detail infor- mation. moisture sensitivity this product is qualifi ed as moisture sensitive level 4 per jedec j-std-020. precautions when handling this moisture sensitive product is important to ensure the reli- ability of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use C unopen moisture barrier bag (mbb) can be stored at < 40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the humidity indicator card (hic) indicates that baking is not required, then it is safe to refl ow the leds per the original msl rating. C it is not recommended to open the mbb prior to assembly (e.g. for iqc). b. control after opening the mbb C the humidity indicator card (hic) shall be read immediately upon opening of mbb. C the leds must be kept at < 30c/60%rh at all time and all high temperature related process including soldering, curing or rework need to be completed within 72 hours. c. control for unfi nished reel C for any unused leds, they need to be stored in sealed mbb with desiccant or desiccator at < 5%rh. d. control of assembly boards C if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at < 5%rh to ensure no leds have exceeded their fl oor life of 72 hours. e. baking is required if C hic 10% indicator is not blue and 5% indicator is pink. C the leds are exposed to condition of > 30c/60%rh at any time. C the leds fl oor life exceeded 72 hrs. recommended baking condition: 605c for 20 hrs. disclaimer: avagos products and software are not specifi cally designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.


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